Atomic Layer Deposition System

Product Description

Advantages of ALD System
Perfect films:
ALDprovides digital thickness control to atomic level since the film is deposited one atomic layer at a time.
Pinhole free films, even over very large areas.
Excellent repeatability (wide process windows: ALD is not sensitive to temperature or precursor dose variations).
Low defect density.
Amorphous or crystalline depending on substrate and temperature.
Digital control of sandwiches, heterostructures, nanolaminates, mixed oxides, graded index layers and doping.
Insensitive to dust (grows underneath dust!).
Oxides,nitrides, metals, semiconductors possible (Cambridge NanoTech provides standard recipes).
100% film density guarantees ideal material properties (n, Ebd, k, etc).
Conformal Coating:
Perfect 3D conformality, 100% step coverage: uniform coatings on flat, inside porous and around particle samples.
Atomically flat and smooth coating, copies shape of substrate perfectly.
Large area thickness uniformity.
Easy batch scalability (precursor sources are small and stacking of substrates is possible).
Challenging Substrates:
Gentle deposition process for sensitive substrates, no plasma needed (though it is available as an option).
Low temperature deposition possible (RT-400 °C).
Coats on everything, even on PTFE.
Excellent adhesion due to chemical bonds at the first layer.
Low stress because of molecular self assembly.