Laser Micro Machining Systems

Product Description

 
 
Products: -MSV101 - Laser Micromachining and Inkjet for R&D and Wafer processes -MSV 2500i Ink jet material deposition tool -MSV W1 Advanced PV Wafer laser Processing -MSV 2508 ITO and Thin film patterning tool -MSV308 - Direct Laser Ablation of Circuit Boards -MSV208 - High throughput production for thin film patterning and removal Applications: 
PV Solar
-Photovoltaic Cell Manufacture -Thin Film Series Interconnection -Laser Edge Isolation -Laser Grooved Buried Conductors -Future applications -Laser Fired Contacts -Industrial Inkjet -Emitter Wrap Through - EWT Microelectronics -Laser TCO Patterning -Double Sided Laser Processing -Photoresist patterning -Circuit Board High Density Interconnection (HDI) -Industrial Inkjet
 System Integration -Software and User Interface -Industrial Lasers -Industrial Inkjet Heads -Motion Control Systems -CNC Automation Application Laboratory Capabilities -Industrial Inkjet Services -Galvanometer Scanners -Contract R&D